Responsibilities- Technical leadership, guiding the design and execution of advanced IC packages for multi-chip RFIC/SoC integration.- Develop 2.5D packages with UCIe chip-to-chip interconnects and interposer-based solutions.- Work on single-sided and double-sided RDL designs and on-package RF antenna structures.- Co-optimize package designs for signal integrity, power integrity, thermal, and mechanical performance in collaboration with RFIC, digital, and system engineers.- Drive material selection, DFM, and reliability qualification to meet automotive-grade requirements (AEC-Q).- Perform stress, warpage, and thermal simulations using tools such as ANSYS.- Maintain and leverage relationships with OSATs, substrate suppliers, and ecosystem partners to accelerate development.- Create and review electrical performance analysis (signal path length, PDN, crosstalk/noise etc.), mechanical analysis and drawings, stack-ups, and layout constraints.- Lead failure analysis and root cause investigations for packaging and reliability issues and provide solutions to increase yield.- Contribute to the packaging roadmap and scalability plan for automotive volume production.Key Qualifications- 10+ years of experience in IC packaging design and development, including leadership responsibilities.- Proven track record with multi-chip packages, digital + RF integration, and automotive applications.- Deep knowledge of UCIe interconnects, organic substrates, interposers, and advanced packaging architectures.- Experience with RF antenna integration in package designs.- Proficient in Flip-Chip, Fan-Out, 2.5D integration, and heterogeneous system-in-package solutions.- Strong understanding of packaging electrical performance such as signal and power integrity, mechanical stress, thermal management, and reliability analysis.- Established network with packaging vendors and OSATs.- M.S. or Ph.D. in Mechanical Engineering, Materials Science, Electrical Engineering, or related field.- Excellent communication skills and ability to thrive in a fast-paced start-up environment.Why Join- Technical oversight, defining packaging solutions for breakthrough ADAS technology.- Collaborate with a world-class engineering team spanning RFIC, SoC, and system design.- Be part of a well-funded start-up bringing innovative sensing technology to market.- Competitive compensation, stock options, and flexible work arrangements.LocationHybrid work from one of our offices:- Bay Area, CA- Boston, MA