Teradar is pioneering a new era in perception with the world’s first automotive terahertz vision sensor, delivering ultra-high-resolution imaging in any weather condition. Founded in Boston, Teradar’s solid-state, chip-scale technology unlocks safer, marter vehicles and opens the door to transformative applications in mobility, defense, and beyond. We are looking to hire an IC Packaging Engineer who will own the development and delivery of advanced packaging solutions for THz system RFIC & SoC applications. This is a high-impact role that combines technical leadership, hands-on thermo-mechanical and physical design, and vendor management to bring cutting-edge multi-chip packages into production. Location: San Jose CA (hybrid). Responsibilities: Technical leadership, guiding and personally executing the physical and structural design of advanced IC packages for multi-chip RFIC/SoC integration; Develop 2.5D packages with UCIe chip-to-chip interconnects and interposer-based solutions; Work on single-sided and double-sided RDL designs and on-package RF antenna structures; Hands-on execution of structural, warpage, and thermal simulations using tools such as ANSYS to ensure package integrity under harsh automotive conditions; Co-optimize package designs for thermal, mechanical, and physical layout performance, collaborating closely with dedicated internal SIPI, RFIC, and digital teams; Drive material selection, DFM, and reliability qualification to meet automotive-grade requirements (AEC-Q); Maintain and leverage relationships with OSATs, substrate suppliers, and ecosystem partners to accelerate development; Create and review detailed mechanical analysis and drawings, substrate stack-ups, physical layout constraints, and co-review electrical performance boundaries; Lead failure analysis and root cause investigations for packaging and reliability issues and provide structural solutions to increase yield; Contribute to the packaging roadmap and scalability plan for automotive volume production.